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Broadcom Corporation has added a new GNSS wireless connectivity chip to its automotive portfolio, which it unveiled at CES 2016, being held this week in Las Vegas. Automotive GPS shipments are expected to more than double by 2022, creating significant opportunities among component suppliers and increasing competition for market share. The chip offers wideband capture radio technology for simultaneous tri-band reception of all visible GNSS satellites including GPS, Galileo, QZSS, GLONASS, BeiDou and global SBAS augmentation systems. Broadcom’s BCM89774 provides improved location and positioning while lowering power consumption for in-vehicle applications and reduces bill of materials cost for car makers, by integrating the sensor hub and CPU on a single chip. The BCM89774 delivers original equipment manufacturers (OEMs) one of the most accurate solutions available today, Broadcom said. The new chip also improves positioning in dense urban environments and foliage-blocked areas to enhance the consumer experience. Optimized to meet the rigorous standards of the automotive industry, the BCM89774 has been tested to AECQ100 automotive environmental stress requirements, is manufactured in TS16949 certified facilities, and offers full production part approval process (PPAP) support. “Broadcom’s new GNSS connectivity chip for automotive keeps car makers and tier one suppliers ahead of the curve with advanced precision and reduced power consumption while lowering BOM cost,” said Richard Barrett, Broadcom Director of Automotive Wireless Connectivity. “By delivering premium products that meet automotive grade requirements, we are positioned for growth in this accelerating market.” Key Features: Low-power mode for emergency service and theft tracking applications Location awareness capabilities added to traditional functions of a sensor hub for lower power consumption and BOM costs Simultaneous reception of GPS, GLONASS, BDS, QZSS and Galileo navigation satellites Support for global Satellite Based Augmentation System (SBAS) system Management of CAN BUS inputs and sensors such as accelerometers, gyroscopes, and magnetometers to provide a fused sensor data tracking subsystem Best-in-class acquisition, tracking sensitivity and time-to-first-fix in both cold and hot starts Full pass through capability for external host-based systems Tested to AECQ100 automotive environmental stress requirements and manufactured in TS16949 certified facilities Full production part approval process (PPAP) support Availability
The BCM89774 is currently sampling.

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